Grounding and Bonding Flashcards
7 cards from real NEC practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.
Read the first 7 Grounding and Bonding flashcards as text
Under NEC 250.50, when multiple grounding electrodes are present at a structure, what must be done?
Answer: They must all be bonded together to form a grounding electrode system
NEC 250.50 requires all grounding electrodes present at a structure to be bonded together into a single grounding electrode system.
Per NEC 250.118, which of the following is NOT listed as an acceptable equipment grounding conductor type?
Answer: A bare aluminum conductor run underground in direct contact with the earth
Bare aluminum conductors are not permitted as EGCs underground in direct earth contact due to corrosion; NEC 250.118 does not list this as an acceptable EGC.
What does NEC 250.148 require regarding equipment grounding conductors in junction boxes?
Answer: All EGCs must be connected together and to the box if it is metal
NEC 250.148 requires all EGCs entering a box to be connected together and, if the box is metal, to the box itself.
What is a 'concrete-encased electrode' (Ufer ground) per NEC 250.52(A)(3)?
Answer: At least 20 feet of #4 AWG or larger steel rebar or wire encased in concrete in contact with earth
NEC 250.52(A)(3) defines a concrete-encased electrode as at least 20 feet of 1/2-inch rebar or 4 AWG wire encased in at least 2 inches of concrete in contact with the earth.
Per NEC 250.97, where high-voltage (over 250V to ground) service conduit connections are made to enclosures, what is required?
Answer: Bonding jumpers around reducing washers and concentric or eccentric knockouts
NEC 250.97 requires bonding jumpers to be used around reducing washers or impaired knockouts at over 250V services to ensure a reliable bond.
Under NEC 250.36, what type of grounding is used for a high-impedance grounded neutral system?
Answer: The neutral is connected to ground through an impedance device to limit fault current
NEC 250.36 covers high-impedance grounded neutral systems where an impedance device connects the neutral to ground, limiting ground fault current.
According to NEC 250.4(A)(5), what is the primary purpose of equipment bonding?
Answer: To establish a low-impedance path to facilitate overcurrent device operation during ground faults
NEC 250.4(A)(5) states that bonding must provide a low-impedance path that enables the overcurrent device to operate and clear ground faults quickly.